COMV Committee_2026
General Chairs
Shengcai Liao, United Arab Emirates University, United Arab Emirates,IEEE Fellow, IAPR Fellow
Program Chairs
Bennett Allan Landman, IEEE FELLOW, Vanderbilt University, USA
Hengyong Yu, IEEE FELLOW, University of Massachusetts Lowell, USA
Kun Sun, China University of Geosciences (Wuhan), China
Publication Chair
Alexei Sourin, Nanyang Technological University, Singapore
CHAN Chee Yong, National University of Singapore, Singapore
Publicity Chairs
Xudong Jiang (IEEE Fellow), Nanyang Technological University, Singapore
Local Chair
Yuanyuan Liu, China University of Geosciences (Wuhan), China
Technical Program Committees
Xiaobin Chang, Sun Yat-sen University, China
Libin Zheng, Sun Yat-sen University, China
Hatanaka Yuji, The University of Shiga Prefecture, Japan
Yubing Tong, University of Pennsylvania, USA
Yao Zhou, Sichuan University, China
Muhammad Shahid Anwar, Gachon University, South Korea
El Houssain Ait Mansour, Secure-IC, France
Ruiheng Zhang, Beijing Institute of Technology, China
Md Liakat Ali, Rider University, USA
Waleed Abdulla, The University of Auckland, New Zealand
Rebeka Sultana, Tokyo University of Agriculture and Technology, Japan
Cheng Siong Chin, Newcastle University, Singapore
Jiankun Hu, The University of New South Wales, Australia
Lili Liu, National University of Singapore, Singapore
Philippe Durand, Conservatoire National des Arts et Metiers, France
Rushit Dave, Minnesota State University, USA
Paulo Batista, University of Évora, Portugal
Liguo Wang, Harbin Engineering University, China
Howard TANG, Nanyang Technological University, Singapore
Yoshihiro Mitani, Ube National College of Technology, Japan
Stefano Berretti, University of Florence, Italy
Lu Leng, Nanchang Hangkong University, China
Xianfang Sun, Cardiff University, UK
Peiqin Li, National University of Defense Technology, China
Suk-Ho Lee, Dongseo University, Korea
Sukanya Phongsuphap, Mahidol University, Thailand
Anwaar Ulhaq, Central Queensland University, Sydney, Australia
M. Firoz Mridha, American International University-Bangladesh, Bangladesh
Xiaorong Li, Singapore Institute of Technology, Singapore
Zhenkai Xiong, Anhui University of Science and Technology, China
